3G-Shenzhen Fuzhongqi Technology Co., Ltd.

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Home >Products >Co-processors >3G

CPU

ARM
RISC-V
LoongArch
X86
MIPS
FPGA
XBurst
NPU
ASIC(Application Specific Integrated Circuit)
DSP(Digital Signal Processor)

Co-processors

GPU
VPU(Video Processing Unit)
NPU(Neural network Processing Unit)
2D(Graphics Processing Unit)
IPU(Imaging Processing Unit)
Built-in DDR
5G
4G
3G
ISP(Image Signal Processor)
Wi-Fi
Bluetooth
Audio Codec

Interfaces

Applications & Solutions

Mini Computer
Automotive
Electric Automobile
D20Mobile
Communication
Smart City
Industrial
Smart Home
Smart manufacturing
IoT(Internet of Things)
New Energy
Medical and Healthcare
Intelligent Buildings
Personal Electronics & Wearable
Robot
Drone
Industry 4.0

Storage Size

256M
512M
1G
2G
4G
8G
16G
32G
64G
128G
256G

Operating temperature

−20℃ to 70℃
−20℃ to 75℃
−20℃ to 80℃
0℃ to 50℃
−20℃ to 85℃
−20℃ to 95℃
−10℃ to 75℃
−40℃ to 85℃
−25℃ to 85℃
−20℃ to 60℃

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Shenzhen Fuzhongqi Technology Co., Ltd.
phone: +8618682038523(wechat、skype、whatsapp)
Email:darcy_liao@fuzqi.com
Address: 1610, Block A, Goldman Sachs Tower, Shajing, Shenzhen, Guangdong, China

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